Produtos
Board Level ConnectorsUHD Connectors
Amphenol’s Ultra High Density (UHD) interconnect packaging solution combines high interconnect density (80 contacts per linear inch) and design flexibility with proven technologies to meet a wide range of advanced, high reliability packaging requirements. It is well suited for all military and aerospace programs. The foundation of the UHD connector is a downsized version of the proven MIL-C-28859 tuning fork and MIL-C-28754 blade contact technologies. The UHD connector packages 396 contacts with two mounting attachments into the SEM-E format, using an eight rob 0.100″ X 0.050″ staggered grid to optimize trace routing through the backplane.
Características e Benefícios
* Temperature Range: -65°C to +125°C
* Current Rating (individual contact): 2 amps DC at 25°C
* Current Rating (multiple contacts): 1 amp DC at 25°C
* Dielectric Withstanding Voltage (DQV): 600V (RMS) at 60 Hz
* Insulation Resistance: 1,000 Megohms
* Contact Resistance: 30 milliohms maximum
* Contact-to-Backplane Retention Force: 3 lb. minimum
* Contact Life (durability): 500 cycles
* Contact Engagement Force: 2.25 ounce maximum average
* Contact Normal Force: 1.0N (3.53 ozf) average
* Contact Wipe Length: 0.053 inch minimum
Aplicações
