At Amphenol Borisch Technologies we understand that high reliability electronics requires state-of-the art equipment, experienced and passionate people, and rigorous process validation. We work closely with our customers during the New Product Introduction (NPI) stage to ensure that products meet or exceeds all requirements and expectations right from the very start of the project.
Características e Benefícios
* Automated Select Solder, Press-fit and Hand Solder for Through Hole
* Single & Double-sided BGA’s and uBGAs
* High Density Packages (0201)
* Chip on Board
* Conformal Coat: UR, UL and Parylene