Bergstak® 0.80mm Pitch

FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol ICC’s BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5mm to 20mm stack heights in 1mm increments